Foreword to Special Issue on Solder Geometry

Authors

Stephen M. Heinrich, Marquette UniversityFollow

Document Type

Article

Language

eng

Format of Original

1 p.

Publication Date

9-1996

Publisher

American Society of Mechanical Engineers

Source Publication

Journal of Electronic Packaging

Source ISSN

1043-7398

Original Item ID

doi: 10.1115/1.2792139

Comments

Journal of Electronic Packaging, Vol. 118, No. 3 (September 1996): 113. DOI.

Recommended Citation

Heinrich, Stephen M., "Foreword to Special Issue on Solder Geometry" (1996). Civil and Environmental Engineering Faculty Research and Publications. 101.
https://epublications.marquette.edu/civengin_fac/101