Solder Joint Formation in Surface Mount Technology—Part II: Design

Authors

Stephen M. Heinrich, Marquette UniversityFollow
Nicholas J. Nigro, Marquette UniversityFollow
A. F. Elkouh, Marquette University
Ping S. Lee, Rockwell AutomationFollow

Document Type

Article

Language

eng

Format of Original

4 p.

Publication Date

9-1990

Publisher

American Society of Mechanical Engineers

Source Publication

Journal of Electronic Packaging

Source ISSN

1043-7398

Original Item ID

doi: 10.1115/1.2904370

Abstract

In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae.

Comments

Journal of Electronic Packaging, Vol. 112, No. 3 (September 1990): 219-222. DOI.

Recommended Citation

Heinrich, Stephen M.; Nigro, Nicholas J.; Elkouh, A. F.; and Lee, Ping S., "Solder Joint Formation in Surface Mount Technology—Part II: Design" (1990). Civil and Environmental Engineering Faculty Research and Publications. 97.
https://epublications.marquette.edu/civengin_fac/97