Electrical characterization of flux/substrate interface
Solderability and processibility of soldering depend upon both the quality of the flux in a solder paste and the surface condition of the substrate of a printed circuit board. A means of monitoring solderability has been developed using both AC and DC electrical techniques. A physical model of solder paste has been developed from the results obtained from AC impedance data. The parameters obtained from these studies followed the well behaved scientific laws (e.g., Henry's Law and Arrhenius Relationship). A number of flux/interface systems were evaluated using a variety of solder pastes and substrates. A correlation was established between the results obtained from AC and DC methods.
Mohammad Nurul Amin,
"Electrical characterization of flux/substrate interface"
(January 1, 1997).
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