Document Type
Article
Language
eng
Publication Date
6-1-2015
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Source Publication
IEEE Transactions on Components, Packaging and Manufacturing Technology
Source ISSN
2156-3950
Abstract
Surface adhesion phenomena of gold-plated copper contact materials are studied in conditions of nonarc load (5/15/25 V and 0.2/0.5/1 A) and superlow speed (25 and 50 nm/s) realized by a piezoactuator during the making and breaking processes. It is shown that softening and melting of local asperities leads to interface adhesion, which results from the joule heat generated by the contact resistance; it is determined that the change of contact force with time obeys the negative exponential distribution and the time constant is associated with the adhesion force directly. Based on the fitting experimental data, the relationship between the adhesion force F z and the contact resistance R d while breaking can be expressed as F z ∝ R d -1 , which indicates that the main component of contact resistance is the bulk resistance of weld nugget and the constriction resistance is negligible.
Recommended Citation
Ren, Wanbin; Chang, Cheng; Chen, Yu; Xue, Shengjun; and Coutu, Ronald A. Jr., "Investigation of the Surface Adhesion Phenomena and Mechanism of Gold-Plated Contacts at Superlow Making/Breaking Speed" (2015). Electrical and Computer Engineering Faculty Research and Publications. 333.
https://epublications.marquette.edu/electric_fac/333
ADA accessible version
Comments
Accepted version. IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 6 (June 2015 ): 771-778. DOI. © 2018 IEEE. Used with permission.
Ronald A. Coutu, Jr. was affiliated with the Department of Electrical and Computer Engineering, Air Force Institute of Technology, Wright-Patterson AFB, OH at the time of publication.