Improved Yield and Performance of Ball-grid Array Packages: Design and Processing Guidelines for Uniform and Nonuniform Arrays

Document Type

Article

Language

eng

Format of Original

10 p.

Publication Date

5-1996

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Source Publication

IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B

Source ISSN

1070-9894

Original Item ID

doi: 10.1109/96.496034

Abstract

Two models are presented for analyzing ball-grid array (BGA) solder interconnects: (a) a model for predicting solder joint geometries after an upright or inverted reflow process and (b) a reliability model for estimating maximum shear strain and fatigue life under a global thermal mismatch load condition. The reliability model includes a newly derived closed-form expression relating the maximum shear strain in a solder joint to the load, material, and joint shape parameters. The models are used to generate design/processing guidelines that may be used to improve the yield of a BGA soldering operation and the in-service reliability of the interconnect. Potential benefits of using a nonuniform array (i.e. one including joints of different size and shape) are explored

Comments

IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Vol. 19, No. 2 (May 1996): 310-319. DOI.

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