Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints
Format of Original
American Society of Mechanical Engineers
Journal of Electronic Packaging
Original Item ID
This paper discusses the application of the parametric finite element method for predicting shapes of three-dimensional solder joints. With this method, the surface of the joint is meshed (discretized) with finite elements. The spatial variables (x, y, z) are expanded over each element in terms of products of interpolation (blending) functions expressed in parametric form and element nodal coordinates. The element nodal coordinates which are not constrained by the boundary conditions are determined by minimizing the potential energy function which governs the joint formation problem. This method has been employed successfully in the past to predict the shapes of two dimensional fillet and axisymmetric joints. In this paper, the method is extended to three dimensional problems involving sessile drops formed on a rectangular pad and solder columns formed between two horizontal planes and subject to a vertical force.