Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

Authors

A. F. Elkouh, Marquette University
N. Ramasubramanian, Marquette UniversityFollow
T. F. Hsu, Marquette UniversityFollow
Nicholas J. Nigro, Marquette UniversityFollow
Stephen M. Heinrich, Marquette UniversityFollow
Ping S. Lee, Rockwell AutomationFollow
D. Shangguan, Ford Motor CompanyFollow

Document Type

Article

Language

eng

Format of Original

7 p.

Publication Date

12-1997

Publisher

American Society of Mechanical Engineers

Source Publication

Journal of Electronic Packaging

Source ISSN

1043-7398

Original Item ID

doi: 10.1115/1.2792248

Abstract

Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation of the solder joints is developed and then solved numerically for the cases of single upright joints, single inverted joints, and through-hole joints. Results are presented in terms of the following dimensionless parameters: bond number, solder volume, board thickness, and tinning radius. The dimensionless approach makes the results from this study suitable for use in a broader range of applications.

Comments

Journal of Electronic Packaging, Vol. 119, No. 4 (December 1997): 268-274. DOI.

Recommended Citation

Elkouh, A. F.; Ramasubramanian, N.; Hsu, T. F.; Nigro, Nicholas J.; Heinrich, Stephen M.; Lee, Ping S.; and Shangguan, D., "Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint" (1997). Civil and Environmental Engineering Faculty Research and Publications. 91.
https://epublications.marquette.edu/civengin_fac/91