Solder Joint Formation in Surface Mount Technology—Part I: Analysis

Authors

Stephen M. Heinrich, Marquette UniversityFollow
A. F. Elkouh, Marquette University
Nicholas J. Nigro, Marquette UniversityFollow
Ping S. Lee, Rockwell AutomationFollow

Document Type

Article

Language

eng

Format of Original

9 p.

Publication Date

9-1990

Publisher

American Society of Mechanical Engineers

Source Publication

Journal of Electronic Packaging

Source ISSN

1043-7398

Original Item ID

doi: 10.1115/1.2904369

Abstract

An analytical model of solder joint formation during a surface mount reflow process is developed in the present paper, and the solution is obtained in an explicit integral form. For two limiting cases—infinitesimal and infinite solder areas—the solution is expressed in closed form. Numerical results illustrate the influence of the process parameters (surface tension, density, and cross-sectional area of the molten solder, and the contact angles between the solder and pretinning) on joint shape and overall fillet dimensions. Comparisons between theoretical predictions and laboratory data show excellent agreement.

Comments

Journal of Electronic Packaging, Vol. 112, No. 3 (September 1990): 210-218. DOI.

Recommended Citation

Heinrich, Stephen M.; Elkouh, A. F.; Nigro, Nicholas J.; and Lee, Ping S., "Solder Joint Formation in Surface Mount Technology—Part I: Analysis" (1990). Civil and Environmental Engineering Faculty Research and Publications. 98.
https://epublications.marquette.edu/civengin_fac/98