Solder Joint Formation in Surface Mount Technology—Part I: Analysis
Format of Original
American Society of Mechanical Engineers
Journal of Electronic Packaging
Original Item ID
An analytical model of solder joint formation during a surface mount reflow process is developed in the present paper, and the solution is obtained in an explicit integral form. For two limiting cases—infinitesimal and infinite solder areas—the solution is expressed in closed form. Numerical results illustrate the influence of the process parameters (surface tension, density, and cross-sectional area of the molten solder, and the contact angles between the solder and pretinning) on joint shape and overall fillet dimensions. Comparisons between theoretical predictions and laboratory data show excellent agreement.