Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint
Format of Original
American Society of Mechanical Engineers
Journal of Electronic Packaging
Original Item ID
Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation of the solder joints is developed and then solved numerically for the cases of single upright joints, single inverted joints, and through-hole joints. Results are presented in terms of the following dimensionless parameters: bond number, solder volume, board thickness, and tinning radius. The dimensionless approach makes the results from this study suitable for use in a broader range of applications.