The purpose of this work was to investigate the validity of Arrhenius accelerated-life testing when applied to gallium nitride (GaN) high electron mobility transistors (HEMT) lifetime assessments, where the standard assumption is that only critical stressor is temperature, which is derived from operating power, device channel-case, thermal resistance, and baseplate temperature. We found that power or temperature alone could not explain difference in observed degradation, and that accelerated life tests employed by industry can benefit by considering the impact of accelerating factors besides temperature. Specifically, we found that the voltage used to reach a desired power dissipation is important, and also that temperature acceleration alone or voltage alone (without much power dissipation) is insufficient to assess lifetime at operating conditions.
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Coutu, Ronald A. Jr.; Lake, Robert A.; Christiansen, Bradley D.; Heller, Eric R.; Bozada, Christopher A.; Poling, Brian S.; Via, Glen D.; Theimer, James P.; Tetlak, Stephen E.; Vetury, Ramakrishna; and Shealy, Jeffrey B., "Benefits of Considering More than Temperature Acceleration for GaN HEMT Life Testing" (2016). Electrical and Computer Engineering Faculty Research and Publications. 355.
ADA accessible version
Published version. Electronics, Vol. 5, No. 32 (2016) DOI. © 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
Ronald A. Coutu, Jr. was affiliated with Air Force Institute of Technology at the time of publication.