Document Type

Article

Language

eng

Publication Date

7-25-2016

Publisher

Institute of Electrical and Electronic Engineers (IEEE)

Source Publication

2016 IEEE National Aerospace and Electronics Conference (NAECON) and Ohio Innovation Summit (OIS)

Source ISSN

9781509034413

Abstract

A significant problem for space-based systems is multipactor - an avalanche of electrons caused by repeated secondary electron emission (SEE). The consequences of multipactor range from altering the operation of radio frequency (RF) devices to permanent device damage. Existing efforts to suppress multipactor rely heavily on limiting power levels below a multipactor threshold [1]. This research applies surface micromachining techniques to create porous surfaces to control the secondary electron yield (SEY) of a material for multipactor suppression. Surface characteristics of interest include pore aspect ratio and density. A discussion is provided on the advantage of using electroplating (vice etching) to create porous surfaces for studying the relationships between SEY and pore aspect ratio & density (i.e. porosity). Preventing multipactor through SEY reduction will allow power level restrictions to be eased, leading to more powerful and capable space-based systems.

Comments

Accepted version. 2016 IEEE National Aerospace and Electronics Conference (NAECON) and Ohio Innovation Summit (OIS) (July 25-29, 2016). DOI. © 2016 Institute of Electrical and Electronic Engineers (IEEE). Used with permission.

Ronald A. Coutu, Jr. was affiliated with the Air Force Institute of Technology at the time of publication.

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