Date of Award

Summer 1997

Degree Type

Thesis - Restricted

Degree Name

Master of Science (MS)

Department

Mechanical and Industrial Engineering

First Advisor

Nigro, Nicholas J.

Second Advisor

Heinrich, Stephen M.

Third Advisor

Stango, Robert J.

Abstract

Solutions for determination of equilibrium shapes of axisymmetric through-hole solder joint with parametric finite element method are obtained. The case of finite tinning on the board and infinite tinning on the pin is studied. Results are presented graphically in terms of certain dimensionless parameters including dimensionless solder volume, tinning width, and board thickness. Behavior analysis of solder joints is implemented by finite element analysis program ANSYS. The macro programs are developed to incorporate the results of the joint profile predicting program to form the solid model and implement stress/strain analysis with ANSYS code.

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