Document Type
Article
Language
eng
Publication Date
8-2017
Publisher
Public Library of Science (PLoS)
Source Publication
PLoS One
Source ISSN
1932-6203
Abstract
We present a new thermomechanical method and a platform to measure the phase transition temperature at microscale. A thin film metal sensor on a membrane simultaneously measures both temperature and mechanical strain of the sample during heating and cooling cycles. This thermomechanical principle of operation is described in detail. Physical hydrogel samples are prepared as a disc-shaped gels (200 μm thick and 1 mm diameter) and placed between an on-chip heater and sensor devices. The sol-gel transition temperature of gelatin solution at various concentrations, used as a model physical hydrogel, shows less than 3% deviation from in-depth rheological results. The developed thermomechanical methodology is promising for precise characterization of phase transition temperature of thermogels at microscale.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.
Recommended Citation
Byambadorj, Tsenguun; Dashtimoghadam, Erfan; Malakoutian, Mohamadali; Davaji, Benyamin; Tayebi, Lobat; Richie, James E.; and Lee, Chung-Hoon, "On-Chip Detection of Gel Transition Temperature using a Novel Micro-Thermomechanical Method" (2017). Electrical and Computer Engineering Faculty Research and Publications. 281.
https://epublications.marquette.edu/electric_fac/281
Comments
Published version. PLoS One (August 2017). DOI. © 2017 Public Library of Science (PLoS). Used with permission.