Document Type

Article

Language

eng

Publication Date

5-30-2006

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Source Publication

IEEE Transactions on Components and Packaging Technologies

Source ISSN

2156-3950

Abstract

This paper is the first to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)), binary alloy (i.e., Au-palladium (Pd), (Au-(3.7at%)Pd)), and ternary alloy (i.e., Au-Pt-copper (Cu), (Au-(5.0at%)Pt-(0.5at%)Cu)) electric contacts. The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2Omega. Preliminary reliability testing indicates a 3times increase in switching lifetime when compared to microswitches with sputtered Au electric contacts. The ternary alloy exhibited approximately a 6times increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8Omega

Comments

Accepted version. IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 2, (June 2006): 341-349. DOI. © 2018 IEEE. Used with permission.

R.A Coutu was affiliated with the Antenna Technology Branch, Air Force Research Laboratory, Hanscom Air Force Base, MA at the time of publication.

Download
coutu_12299acc.docx (825 kB)
ADA accessible version

Share

COinS