Document Type
Conference Proceeding
Language
eng
Publication Date
2011
Publisher
Institute of Electrical and Electronic Engineers (IEEE)
Source Publication
2011 11th IEEE International Conference on Nanotechnology
Source ISSN
1944-9399
Abstract
In this work we characterized thermally grown cuprous oxide thin films using tunneling atomic force microscopy (TUNA) and optical reflection measurements. Significant hysteresis was observed in the I-V curves measured at the nanometer contact under various bias voltages. Histogram analysis of the barrier voltage distribution indicated the barrier height is related to electrochemical potentials for oxidation/ reduction of copper atoms. Changes in chemical state of copper atoms were identified by optical reflectance measurements in the UV-VIS-NIR wavelength region. The peak shift observed in the optical reflection measurements from the short to the long wavelength is attributed to the quantum size confinement effects of the nanometer-scale cuprous particles formed in the films. The grain size, including surface roughness, was measured by topographic AFM imaging. The fluctuations in the I-V measurements are likely due to changes of electrochemical properties of cuprous ions in the film, including the grain size distribution. The asymmetric distribution in the barrier height may indicate that a different probability for injecting an electron in and withdrawing an electron from the films.
Recommended Citation
Castle, Brett; Li, Alex; Coutu, Ronald A. Jr.; Hengehold, Robert; and Van Nostrand, Joseph, "Tunneling Atomic Force Microscopy Characterization of Cuprous Oxide Thin Films" (2011). Electrical and Computer Engineering Faculty Research and Publications. 379.
https://epublications.marquette.edu/electric_fac/379
Comments
Accepted version. 2011 11th IEEE International Conference on Nanotechnology Portland Marriott, Accession Number: 12538884 (August 15-18, 2011): 1470-1473. DOI. © 2011 Institute of Electrical and Electronic Engineers (IEEE). Used with permission.
Ronald A. Coutu was affiliated with the Air Force Institute of Technology at the time of publication.