Document Type
Article
Language
eng
Publication Date
9-23-2004
Publisher
Institute of Electrical and Electronic Engineers (IEEE)
Source Publication
Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts Electrical Contacts, 2004.
Source ISSN
0780384601
Abstract
This work is the first to report on a new analytic model for predicting micro-contact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bi-metallic (i.e. gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6%)Pt)), binary alloy (i.e. Au-palladium (Pd), (Au-(2%)Pd)), and tertiary alloy (i.e. Au-Pt-copper (Cu), (Au-(5%)Pt-(0.5%)Cu)) electric contacts. The micro-switches with bi-metallic and binary alloy contacts resulted in contact resistance between 1-2 /spl Omega/ and, when compared to micro-switches with sputtered Au electric contacts, exhibited a 3.3 and 2.6 times increase in switching lifetime, respectively. The tertiary alloy exhibited a 6.5 times increase in switch lifetime with contact resistance ranging from 0.2-1.8 /spl Omega/.
Recommended Citation
Coutu, Ronald A. Jr.; Kladitis, P. E.; Cortez, R.; Strawser, R. E.; and Crane, Robert L., "Micro-Switches with Sputtered Au, AuPd, Au-on-AuPt, and AuPtCu Alloy Electric Contacts" (2004). Electrical and Computer Engineering Faculty Research and Publications. 426.
https://epublications.marquette.edu/electric_fac/426
Comments
Published version. Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts Electrical Contacts, 2004. (September 23, 2004). DOI.
This material is declared a work of the U.S. Government and is not subject to copyright protection in the United States. Approved for public release; distribution is unlimited.
Ronald A. Coutu was affiliated with the Air Force Institute of Technology at the time of publication.