Document Type
Article
Language
eng
Publication Date
5-2021
Publisher
Institute of Electrical and Electronic Engineers (IEEE)
Source Publication
IEEE Transactions on Industry Applications
Source ISSN
0093-9994
Abstract
In this article, a new configuration of the modular multilevel converter (MLC) based on the parallel connection of three-level active-neutral-point-clamped (3L-ANPC) cells as well as its improved modulation method is proposed for 1 MHz, 1 MW electric vehicle (EV) megacharger. In the proposed paralleled modular ANPC-MLC, only six high-frequency silicon carbide (SiC) power switches operating at 333 kHz are required to generate 1 MHz switching frequency spectrum. Moreover, the operating voltage of all power devices is halved, the magnitude of the first switching frequency harmonic cluster is decreased by the factor of five, and the load current is equally distributed between the 3L-ANPC legs by employing the proposed improved modulation method. Hence, the modularity, efficiency, and power density of the proposed converter are notably increased, whereas the value of passive components and the overall switching loss are remarkably decreased. In addition, an optimized design of the one 3L-ANPC cell of the proposed paralleled modular ANPC-MLC for 1 MHz, 1 MW EV megacharger using Ansys SIwave, Icepak, and Q3D finite element method platforms is presented and analyzed in detail. The provided experimental results of the down-scaled setup verify the feasibility and viability of the proposed configuration as well as its improved switching pattern.
Recommended Citation
Abarzadeh, Mostafa; Khan, Waqar A.; Weise, Nathan; Al-Haddad, Kamal; and EL-Refaie, Ayman M., "A New Configuration of Paralleled Modular ANPC Multilevel Converter Controlled by an Improved Modulation Method for 1 MHz, 1 MW EV Charger" (2021). Electrical and Computer Engineering Faculty Research and Publications. 657.
https://epublications.marquette.edu/electric_fac/657
ADA Accessible Version
Comments
Accepted version. IEEE Transactions on Industry Applications, Vol. 57, No. 3 (May-June 2021): 3164-3178. DOI. © 2021 Institute of Electrical and Electronic Engineers (IEEE). Used with permission.