Heat-Pipe-Based Thermal Management System Design for a 250-kW GaN-Based Integrated Modular Motor Drive

Document Type

Article

Publication Date

4-7-2025

Publisher

Institute of Electrical and Electronic Engineers (IEEE)

Source Publication

IEEE Journal of Emerging and Selected Topics in Power Electronics

Source ISSN

2168-6777

Original Item ID

DOI: 10.1109/JESTPE.2025.3558239

Abstract

Integrated modular motor drive (IMMD) is an effective approach for realizing high-efficiency, high-power-density, and fault-tolerant electric machines. However, designing an efficient thermal management system (TMS) for the motor drive becomes a challenge, particularly due to space constraints. This article presents the design of a TMS based on 3-mm heat pipes for a 250-kW IMMD intended for aviation applications. The power electronics module is simulated using PLECS software where an electrothermal analysis is conducted. A simplified thermal resistance model of the system is developed to estimate the die junction temperature of gallium nitride (GaN) semiconductors. The performance of the proposed TMS is evaluated through experimental tests and compared to an off-the-shelf heat sink. The results demonstrate that, at a fluid temperature of 24∘ C, the designed TMS outperforms the off-the-shelf heat sink. Additionally, the designed TMS was tested with a fluid temperature of 41∘ C, matching the temperature of the coolant fluid in the final application. The results indicated that the maximum estimated die junction temperature of the GaN semiconductors is 95.16∘ C while generating the rated power loss in the converter.

Comments

IEEE Journal of Emerging and Selected Topics in Power Electronics, Vol. 13, No. 4 (April 7, 2025): 4474-4487. DOI.

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