Date of Award
Summer 1994
Document Type
Thesis - Restricted
Degree Name
Master of Science (MS)
Department
Electrical and Computer Engineering
First Advisor
Elkouh, Abdel
Second Advisor
Heinrich, S. M.
Third Advisor
Nigro, N. J.
Abstract
Numerical solutions for the determination of equilibrium shapes of axisymmetric and two dimensional solder joints in electronic packaging are obtained. A surface tension model is the basis for these solutions. The infinite tinning case is studied. For the axisymmetric case an algorithm is developed which gives the dimensions of the joint as a function of the dimensionless volume, Bond number , and the contact angles. The dimensions of the axisymmetric joints obtained by using the axisymmetric model are compared with those obtained by introducing an equivalent area and using a two-dimensional model. The axisymmetric case is extended to study the equilibrium shapes of joints formed between a wire and a board for the case of double-sided joints.
Recommended Citation
Ramasubramanian, Natarajan, "Study of Axisymmetric Solder Joints Used in Electronic Packaging" (1994). Master's Theses (1922-2009) Access restricted to Marquette Campus. 3828.
https://epublications.marquette.edu/theses/3828