Date of Award
Fall 1990
Document Type
Thesis - Restricted
Degree Name
Master of Science (MS)
Department
Mechanical and Industrial Engineering
First Advisor
Fournelle, Raymond A.
Second Advisor
Nigro, N. J.
Third Advisor
Heinrich, Stephen M.
Abstract
The cross sectional profiles of solder joints formed in upright rectangular corners were characterized metallographically and compared with the theoretically calculated profiles. Solder joints in pretinned rectangular corners in copper specimens were prepared by reflow soldering corners containing differing amounts and shapes of solder paste. Specimens were then sectioned to reveal the cross sectional shape of the joints. These joints were then characterized metallographically for both macroscopic shape and microstructure. The macroscopic shapes were compared with those predicted by existing theory and found to be in good agreement with it.
Recommended Citation
Whang, Chih-Ping, "The Cross Sectional Shape of Solder Joints Formed in Rectangular Corners During Reflow Soldering" (1990). Master's Theses (1922-2009) Access restricted to Marquette Campus. 4307.
https://epublications.marquette.edu/theses/4307