Date of Award
Summer 1996
Document Type
Thesis - Restricted
Degree Name
Master of Science (MS)
Department
Mechanical Engineering
First Advisor
Elkouh, Abdel
Second Advisor
Nigro, Nicholas J.
Third Advisor
Heinrich, Stephen
Abstract
Solutions for axisymmetric profiles of solder joints formed between a cylindrical wire and a printed circuit board (PCB) are presented in this thesis. The differential equation governing the formation of these solder joints is developed and then solved numerically for the cases of single upright joints, single inverted joints, and through-hole joints. Results are presented graphically in terms of certain dimensionless parameters including the Bond number, the volume number, the board thickness number, and the tinning radius number.
Recommended Citation
Hsu, Ta-Fan, "Prediction of Solder Geometry for An Axisymmetric Through-Hole Joint" (1996). Master's Theses (1922-2009) Access restricted to Marquette Campus. 4835.
https://epublications.marquette.edu/theses/4835