Date of Award

12-1996

Document Type

Thesis - Restricted

Degree Name

Master of Science (MS)

Department

Mechanical Engineering

First Advisor

Nicholas J. Nigro

Second Advisor

Stephen M. Heinrich

Third Advisor

Abdel F. Elkouh

Abstract

Surface Mount Technology (SMT) is a method by which electronic components are mounted to the surface of a printed circuit board (PCB) with the use of solder paste. The solder is used to form the electrical and mechanical connections between the component and the board. SMT allows placement of more surface mount components (SMC) into smaller and tighter PCB areas (Lau, 1994). A SMC is any electrical component, leaded or leadless, mounted on one or both sides of a substrate. In contrast, a "conventional component is connected to the substrate via a through-hole solder joint where the component's leads make metallurgical connections on both sides of the substrate and within the plated through-hole" (Capillo, 1990). The advent of integrated circuit (IC) technology and the requirements of high packing density is driving the design of SMC to higher pin count and smaller package size. When the lead spacing of an SMC is equal to or less than 0.65 mm, then it is called a fine pitch SMC. Any SMT with fine pitch SMCs is called fine pitch technology (FTP) (Lau, 1994).

Comments

A Thesis Submitted to the Faculty of the Graduate School, Marquette University, in Partial Fulfillment of the Requirements for the Degree of Master of Science, Milwaukee, Wisconsin

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