The Civil and Environmental Engineering Faculty Research and Publications Series is comprised of books and articles published by Marquette University's civil and environmental engineering faculty.
Submissions from 1997
Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint, A. F. Elkouh, N. Ramasubramanian, T. F. Hsu, Nicholas J. Nigro, Stephen M. Heinrich, Ping S. Lee, and D. Shangguan
Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints, Stephen M. Heinrich, Shilak Shakya, and Ping S. Lee
Submissions from 1996
Foreword to Special Issue on Solder Geometry, Stephen M. Heinrich
Membrane Analogy for Saint-Venant Torsion: New Results, Stephen M. Heinrich
Prediction of Solder Joint Geometries in Array-Type Interconnects, Stephen M. Heinrich, M. Schaefer, Scott A. Schroeder, and Ping S. Lee
Improved Yield and Performance of Ball-grid Array Packages: Design and Processing Guidelines for Uniform and Nonuniform Arrays, Stephen M. Heinrich, Shilak Shakya, Yanhua Wang, Ping S. Lee, and Scott A. Schroeder
Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints, Nicholas J. Nigro, F. J. Zhou, Stephen M. Heinrich, A. F. Elkouh, Raymond Fournelle, and Ping S. Lee
Submissions from 1995
An Approximate Model for Predicting the Size and Shape of Wave-soldered Surface-mount Joints, B. U. Nambisan, Stephen M. Heinrich, Raymond Fournelle, A. F. Elkouh, Nicholas J. Nigro, and P. S. Lee
Submissions from 1994
Knowledge‐Based Expert System for Concrete Mix Design, Yong Bai and Serji N. Amirkhanian
Prediction of Solder Joint Geometry, Stephen M. Heinrich
Dynamic Modeling of Slab Formwork during Concrete Placement, Saeed Karshenas and Stephen M. Heinrich
Submissions from 1993
[Review of] Variational Methods in Mechanics, Stephen M. Heinrich
Effect of Chip and Pad Geometry on Solder Joint Formation in SMT, Stephen M. Heinrich, Paul Edwin Liedtke, Nicholas J. Nigro, A. F. Elkouh, and P. S. Lee
Finite Element Method for Predicting Equilibrium Shapes of Solder Joints, Nicholas J. Nigro, A. F. Elkouh, X. Zou, Raymond Fournelle, Stephen M. Heinrich, and Ping S. Lee
Submissions from 1992
Effect of Dead Space on Gain and Noise of Double-Carrier-Multiplication Avalanche Photodiodes, Majeed M. Hayat, B.E.A Saleh, and Malvin Carl Teich
Submissions from 1991
Torsional Stress Interference in Transverse Isotropy, Stephen M. Heinrich
Effect of Workpart Curvature on the Stiffness Properties of Circular Filamentary Brushes, Stephen M. Heinrich, R. J. Stango, and Chih-Yuan Shia
Submissions from 1990
Solder Joint Formation in Surface Mount Technology—Part I: Analysis, Stephen M. Heinrich, A. F. Elkouh, Nicholas J. Nigro, and Ping S. Lee
Solder Joint Formation in Surface Mount Technology—Part II: Design, Stephen M. Heinrich, Nicholas J. Nigro, A. F. Elkouh, and Ping S. Lee
Submissions from 1989
Analysis of Constrained Filament Deformation and Stiffness Properties of Brushes, Stephen M. Heinrich, Chih-Yuan Shia, and Robert Stango
Stress Interference in a Transversely Isotropic Body under Axisymmetric Loading, Stephen M. Heinrich and J. Y. Wang